Electrical Characteristics
(continued)
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Type Min
Typ
Max Units
Switching Characteristics
(Note 2)
t d(on)
Turn-On Delay Time
N-Channel
N-Ch
5
15
ns
V DD = 10 V, I D = 1 A,
P-Ch
7
14
t r
Turn-On Rise Time
V GS = 4.5V, R GEN = 6 ?
N-Ch
9
18
ns
P-Ch
14
25
t d(off)
t f
Turn-Off Delay Time
Turn-Off Fall Time
P-Channel
V DD = -10 V, I D = -1 A,
V GS = -4.5 V, R GEN = 6 ?
N-Ch
P-Ch
N-Ch
12
14
3
22
25
9
ns
ns
P-Ch
3
9
Q g
Total Gate Charge
N-Channel
N-Ch
3.25
4.5
nC
V DS = 10 V, I D = 2.7 A, V GS = 4.5V
P-Ch
2.85
4.0
Q gs
Gate-Source Charge
P-Channel
N-Ch
P-Ch
0.65
0.68
nC
Q gd
Gate-Drain Charge
V DS = -10 V, I D = -1.9 A,V GS = -4.5V
N-Ch
0.90
nC
Drain-Source Diode Characteristics and Maximum Ratings
P-Ch
0.65
I S
Maximum Continuous Drain-Source Diode Forward Current
N-Ch
0.8
A
P-Ch
-0.8
V SD
Drain-Source Diode Forward V GS = 0 V, I S = 0.8 A (Note 2)
Voltage
V GS = 0 V, I S = - 0.8 A (Note 2)
N-Ch
P-Ch
0.76
-0.79
1.2
-1.2
V
Notes:
1: R θ JA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
R θ JC is guaranteed by design while R θ JA is determined by the user's board design. Both devices are assumed to be operating and sharing the dissipated heat energy
equally.
a) 130 ° C/W when
mounted on a 0.125 in 2
pad of 2 oz. copper.
b) 140 ° C/W when
mounted on a 0.005 in 2
pad of 2 oz. copper.
c) 180 ° C/W when
mounted on a 0.0015 in 2
pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDC6327C, Rev. E
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